AMD-K6-2E Datasheet, PDF (281/332 Pages) Advanced Micro Devices – AMD-K6™-2E Embedded Processor

22529B/0—January 2000
Preliminary Information
AMD-K6™-2E Processor Data Sheet
0.254mm (min.) for
isolation region
C5
C18 C17 C20
C6
C19 C21
C7
+ ^C1
+ ^CC3
C22
C23
+ CC4
C24
C11
C2
+
+ ^CC5
C25
CC6
C29
C12
C27 C30
C13
C26 C28 C31
Decoupling
Recommendations
V_CC3 (I/O) Plane
V_CC2 (Core) Plane
CC1
CC2
Figure 88. Suggested Component Placement
In addition to the isolation region mentioned in “Power
Connections” on page 262, adequate decoupling capacitance is
required between the two system power planes and the ground
plane to minimize ringing and to provide a low-impedance path
for return currents. Suggested decoupling capacitor placement
is shown in Figure 88.
Surface mounted capacitors should be used as close as possible
to the processor to minimize resistance and inductance in the
lead lengths while maintaining minimal height.
For recommendations about the specific value, quantity, and
location of the capacitors illustrated in Figure 88, see the AMD-
K6® Processor Power Supply Design Application Note, order
#21103.
Chapter 14
Electrical Data
263