AMD-K6-2E Datasheet, PDF (307/332 Pages) Advanced Micro Devices – AMD-K6™-2E Embedded Processor

22529B/0—January 2000
Preliminary Information
AMD-K6™-2E Processor Data Sheet
Thermally Conductive Epoxy
Thermocouple
Figure 101. Measuring Case Temperature
16.3
Sample Heatsink Measured Data
Example Heatsinks
The example measured data (provided in tables 69 through 72
and figures 105 through 108) shows case-to-ambient thermal
resistance and maximum ambient temperature for both
socketed and soldered processors using three passive heatsink
samples with different height profiles (see Table 68) and
different levels of airflow in the system. This data is based on
the following specification assumptions:
T_C = 85°C = T_C(MAX) for 1.9-V low-power K6-2E processors
P_d = 10 W
q_CA = q_SA + q_IF
T_A(MAX) = T_C(MAX) – (q_CA ·P_d)
T_A(MAX) = 85 - (q_SA + q_IF)·P_d
Note: AMD does not guarantee the example measured heatsink
data provided in tables 69 through 72 and figures 105
through 108. This data is supplied for informational
purposes only to facilitate the selection of an appropriate
thermal solution.
Table 68 describes the three heatsinks tested. Figure 102,
Figure 103, and Figure 104 show the actual heatsinks.
Table 68. Passive Heatsink Samples
Identifier
A
B
C
Size X (mm)
52
52
50
Size Y (mm) Size Z Height (mm)
50
15
50
20
50
30
Chapter 16
Thermal Design
289