PIC18F6525_13 Datasheet, PDF (330/400 Pages) Microchip Technology – 64/80-Pin High-Performance, 64-Kbyte Enhanced Flash Microcontrollers with A/D

PIC18F6525/6621/8525/8621
27.2 DC Characteristics: Power-Down and Supply Current
PIC18F6525/6621/8525/8621 (Industrial, Extended)
PIC18LF6X2X/8X2X (Industrial) (Continued)
PIC18LF6X2X/8X2X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C  TA  +85°C for industrial
PIC18F6525/6621/8525/8621
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C  TA  +85°C for industrial
-40°C  TA  +125°C for extended
Param
No.
Device
Typ Max Units
Conditions
Module Differential Currents (IWDT, IBOR, ILVD, IOSCB, IAD)
D022
(IWDT)
Watchdog Timer <1 2.0 A
<1
2
A
-40C
+25C
VDD = 2.0V
5
20 A
+85C
3
10 A
-40C
3
20 A
+25C
VDD = 3.0V
10 35 A
+85C
12 25 A
-40C
15 35 A
+25C
VDD = 5.0V
D022A
(IBOR)
D022B
(ILVD)
20 50
Brown-out Reset⁽⁴⁾ 55 115
105 175
Low-Voltage Detect⁽⁴⁾ 45 125
45 150
A
+85C
A -40C to +85C
A -40C to +85C
A -40C to +85C
A -40C to +85C
VDD = 3.0V
VDD = 5.0V
VDD = 2.0V
VDD = 3.0V
45 225 A -40C to +85C
VDD = 5.0V
D025
(IOSCB)
Timer1 Oscillator 20 27 A
20 30 A
-10C
+25C
VDD = 2.0V
32 kHz on Timer1
25 35 A
+70C
22 60 A
-10C
22 65 A
+25C
VDD = 3.0V
32 kHz on Timer1
25 75 A
+70C
30 75 A
-10C
30 85 A
+25C
VDD = 5.0V
32 kHz on Timer1
35 100 A
+70C
D026
(IAD)
A/D Converter <1
2
A
<1
2
A
+25C
+25C
VDD = 2.0V
VDD = 3.0V
A/D on, not converting
<1
2
A
+25C
VDD = 5.0V
Legend:
Note 1:
2:
3:
4:
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
The band gap reference is a shared resource used by both BOR and LVD modules. Enabling both modules will
consume less than the specified sum current of the modules.
DS39612C-page 330
 2003-2013 Microchip Technology Inc.