80KSBR200 Datasheet, PDF (169/172 Pages) Integrated Device Technology – sRIO SERIAL BUFFER FLOW-CONTROL DEVICE

IDT 80KSBR200
U19
WRO_N
Write Strobe
(VDD, GND) / CMOS Output
AB17
ZQ
M18
DNC
M19
DNC
T18
DNC
T19
DNC
P-Port
Impedance
Advanced Datasheet*
When QDR type SRAM attached, this output should be con-
nected to the /Wr input on the QDR SRAM(s). The FIFO control-
ler will use this pin to control the write function on the SRAM.
Do Not Connect
Do Not Connect
Do Not Connect
Do Not Connect
17.0 Package Specifications
17.1 Package Physical & Thermal Specifications
Package: Super FlipChip FCBGA(BR484)
Dimensions: 23 x 23mm
Ball Count: 484
Ball Diameter: 0.6mm
Ball Pitch: 1.0mm
Theta JA = {11.9C/W @ 0m/s, 8 C/W @ 1m/s, 7.3 C/W @ 2m/s}
Theta JC = 0.2 C/W
169 of 172
March 19, 2007
„2005 Integrated Device Technology, Inc. All rights reserved. Advanced Datasheet for informational purposes only. Product specifications subject to change without notice.NOT AN OFFER FOR SALE The information presented herein is subject to a
Non-Disclosure Agreement (NDA) and is for planning purposes only. Nothing contained in this presentation, whether verbal or written, is intended as, or shall have the effect of, a sale or an offer for sale that creates a contractual power of acceptance.