MC68HC08BD24 Datasheet, PDF (241/244 Pages) Motorola, Inc – HCMOS Microcontroller Unit

20.4 42-Pin Shrink Dual in-Line Package (SDIP)
–A–
42
22
–B–
1
21
C
L
H
–T–
SEATING
PLANE
F
G
D 42 PL
0.25 (0.010) ^M T A ^S
N
K
M
J 42 PL
0.25 (0.010) ^M T B ^S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC
1.778 BSC
H 0.300 BSC
7.62 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC
15.24 BSC
M
0° 15°
0° 15°
N 0.020 0.040 0.51 1.02
Figure 20-2. 42-Pin SDIP (Case 858)
MC68HC08BD24 — Rev. 1.1
Freescale Semiconductor
Technical Data
241