MC68HC08BD24 Datasheet, PDF (240/244 Pages) Motorola, Inc – HCMOS Microcontroller Unit

20.3 44-Pin Plastic Quad Flat Pack (QFP)
S
0.20 (0.008) M T L-M S N S
A
0.20 (0.008) M H L-M S N S
PIN 1
IDENT
0.05 (0.002) L-M
44
1
34
33
-L-
-M-
-L-, -M-, -N-
J1
G
J1
VIEW Y
3 PL
PLATING
F
BASE METAL
G 40X
11
12
CE
W
DATUM
PLANE
-H-
VIEW Y
23
22
-N-
M
VIEW P
-H-
DATUM
PLANE
0.01 (0.004)
Y
-T-
q1
R R1
R R2
K
A1
q2
C1
VIEW P
J
B1
D
0.20 (0.008) M T L-M S N S
SECTION J1-J1
44 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS -L-, -M- AND -N- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -T-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.90 10.10 0.390 0.398
B 9.90 10.10 0.390 0.398
C 2.00 2.21 0.079 0.087
D 0.30 0.45 0.0118 0.0177
E 2.00 2.10 0.079 0.083
F 0.30 0.40 0.012 0.016
G 0.80 BSC
0.031 BSC
J 0.13 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
M
5° 10°
5° 10°
S 12.95 13.45 0.510 0.530
V 12.95 13.45 0.510 0.530
W 0.000 0.210 0.000 0.008
Y
5° 10°
5° 10°
A1 0.450 REF
0.018 REF
B1 0.130 0.170 0.005 0.007
C1 1.600 REF
0.063 REF
R1 0.130 0.300 0.005 0.012
R2 0.130 0.300 0.005 0.012
q1
5° 10°
5° 10°
q2
0° 7°
0° 7°
Figure 20-1. 44-Pin QFP (Case 824E)
Technical Data
240
MC68HC08BD24 — Rev. 1.1
Freescale Semiconductor