MC68HC08BD24 Datasheet, PDF (239/244 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Technical Data — MC68HC08BD24
Section 20. Mechanical Specifications
20.1 Contents
20.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
20.3 44-Pin Plastic Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . 240
20.4 42-Pin Shrink Dual in-Line Package (SDIP) . . . . . . . . . . . . . . 241
20.2 Introduction
This section gives the dimensions for:
• 44-pin plastic quad flat pack (case 824E-02)
• 42-pin shrink dual in-line package (case 858-01)
The following figures show the latest package drawings at the time of this
publication. To make sure that you have the latest package
specifications, please visit the Freescale website at
http://www.freescale.com. Follow the World Wide Web on-line
instructions to retrieve the current mechanical specifications.
MC68HC08BD24 — Rev. 1.1
Freescale Semiconductor
Technical Data
239