MC68HC11G5 Datasheet, PDF (193/195 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcontroller

Freescale Semiconductor, Inc.
14.3 PACKAGE DIMENSIONS
-N-
Y BRK
B ^{0.18 (0.007) M T N S — P S L S — M S}
D
U ^{0.18 (0.007) M T N S — P S L S — M S}
-L-
-M-
Z1
W
VIEW D-D
D
(Note 1) 84
1
-P-
V
G1
X
0.25 (0.010) M T N S — P S L S — M S
A 0.18 (0.007) M T L S ^— M S N S ^— P S
Z
R 0.18 (0.007) M T L S ^— M S N S ^— P S
H
0.18 (0.007) M T L S —M S N S —P S
0.18 (0.007) M T N S —P S L S —M S
C
E
K1
0.10 (0.004)
G
J
-T- _{SEATING PLANE}
K
DETAIL S
G1
0.25 (0.010) S T L S — M S N S —P S
F
0.18 (0.007) M T L S ^— M S N S ^— P S
0.18 (0.007) M T N S ^— P S L S ^— M S
DETAIL S
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 30.10 30.35 1.185 1.195
B 30.10 30.35 1.185 1.195
C 4.20 4.57 0.165 0.180
E 2.29 2.79 0.090 0.110
F 0.33 0.48 0.013 0.019
G
1.27 BSC
0.050 BSC
HG 0.66 0.81 0.026 0.032
J 0.51 — 0.020 —
K 0.64 — 0.025 —
R 29.21 29.36 1.150 1.156
U 29.21 29.36 1.150 1.156
V 1.07 1.21 0.042 0.048
W 1.07 1.21 0.042 0.056
X 1.07 1.42 0.042 0.056
Y
— 0.50 — 0.020
Z
2°
10°
2°
10°
G1 28.20 28.70 1.110 1.130
K1 1.02 — 0.040 —
Z1 2°
10°
2°
10°
NOTES:
1. DUE TO SPACE LIMITATION, CASE 780-01 SHALL BE
REPRESENTED BY A GENERAL CASE OUTLINE
DRAWING.
2. DATUMS -L-, -M-, -N-, AND -P- DETERMINED
WHERE TOP OF LEAD SHOULDER EXIT PLASTIC
BODY AT MOLD PARTING LINE.
3. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE
4. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION IS 0.25 (0.010) PER
SIDE
5. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982
6. CONTROLLING DIMENSION: INCH
MECHANICAL DATA
14-3
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