AMIC110 Datasheet, PDF (82/214 Pages) Texas Instruments – Sitara Processors

AMIC110
SPRS971A – AUGUST 2016 – REVISED SEPTEMBER 2016
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5.8 Thermal Resistance Characteristics for ZCE and ZCZ Packages
NOTE
The ZCE package is not supported for this family of devices.
Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating
lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the
product design cycle should include thermal analysis to verify the maximum operating junction
temperature of the device. It is important this thermal analysis is performed using specific system use
cases and conditions. TI provides an application report to aid users in overcoming some of the existing
challenges of producing a good thermal design. For more information, see AM335x Thermal
Considerations.
Table 5-12 provides thermal characteristics for the packages used on this device.
NOTE
Table 5-12 provides simulation data and may not represent actual use-case values.
Table 5-12. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ]
ZCE (°C/W)⁽¹⁾
(2)
(°C/W)^{(1) (2)}
AIR FLOW
(m/s) ⁽³⁾
R_ΘJC
R_ΘJB
Junction-to-case
Junction-to-board
10.3
10.2
N/A
11.6
12.1
N/A
24.7
24.2
0
R_ΘJA
Junction-to-free air
20.5
20.1
1.0
19.7
19.3
2.0
19.2
18.8
3.0
0.4
0.3
0.0
φ_JT
Junction-to-package top
0.6
0.6
1.0
0.7
0.7
2.0
0.9
0.8
3.0
11.9
12.7
0.0
φ_JB
Junction-to-board
11.7
12.3
1.0
11.7
12.3
2.0
11.6
12.2
3.0
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the theta JC [R_ΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(2) °C/W = degrees Celsius per watt.
(3) m/s = meters per second.
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