AMIC110 Datasheet, PDF (160/214 Pages) Texas Instruments – Sitara Processors

AMIC110
SPRS971A – AUGUST 2016 – REVISED SEPTEMBER 2016
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7.7.2.3.3.4 Placement
Figure 7-36 shows the required placement for the AMIC110 device as well as the DDR3 devices. The
dimensions for this figure are defined in Table 7-46. The placement does not restrict the side of the PCB
on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space.
X1
X2
DDR3
Interface
Y
Figure 7-36. Placement Specifications
Table 7-46. Placement Specifications⁽¹⁾
NO.
PARAMETER
1 X1^(2)(3)(4)
2 X2⁽²⁾⁽³⁾
3 Y Offset^(2)(3)(4)
4 Clearance from non-DDR3 signal to DDR3 keepout region⁽⁵⁾⁽⁶⁾
MIN
MAX UNIT
1000 mils
600 mils
1500 mils
4
w
(1) DDR3 keepout region to encompass entire DDR3 routing area.
(2) For dimension definitions, see Figure 7-36.
(3) Measurements from center of the AMIC110 device to center of the DDR3 device.
(4) Minimizing X1 and Y improves timing margins.
(5) w is defined as the signal trace width.
(6) Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.
160 Peripheral Information and Timings
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