AMIC110 Datasheet, PDF (100/214 Pages) Texas Instruments – Sitara Processors

AMIC110
SPRS971A – AUGUST 2016 – REVISED SEPTEMBER 2016
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RTC_XTALIN
AMIC110
(ZCE Package)
Optional R_bias
RTC_XTALOUT
Crystal
Optional R_d
C₁
C₂
Copyright © 2016, Texas Instruments Incorporated
A. Oscillator components (Crystal, C₁, C₂, optional R_bias and R_d) must be located close to the AMIC110 package.
Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the
oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest
PCB digital ground (VSS).
B. C₁ and C₂ represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C₁ and C₂ should be selected to
provide the total load capacitance, C_L, specified by the crystal manufacturer. The total load capacitance is C_L = [(C₁ ×
C₂) / (C₁ + C₂)] + C_shunt, where C_shunt is the crystal shunt capacitance (C₀) specified by the crystal manufacturer plus
any mutual capacitance (C_pkg + C_PCB) seen across the AMIC110 RTC_XTALIN and RTC_XTALOUT signals. For
recommended values of crystal circuit components, see Table 6-5.
Figure 6-12. OSC1 (ZCE Package) Crystal Circuit Schematic
AMIC110
(ZCZ Package)
RTC_XTALIN
VSS_RTC
C₁
RTC_XTALOUT
C₂
Crystal
Optional R_d
Optional R_bias
Copyright © 2016, Texas Instruments Incorporated
A. Oscillator components (Crystal, C₁, C₂, optional R_bias and R_d) must be located close to the AMIC110 package.
Parasitic capacitance to the PCB ground and other signals should be minimized to reduce noise coupled into the
oscillator. VSS_RTC and respective crystal circuit component grounds should be connected directly to the nearest
PCB digital ground (VSS).
B. C₁ and C₂ represent the total capacitance of the respective PCB trace, load capacitor, and other components
(excluding the crystal) connected to each crystal terminal. The value of capacitors C₁ and C₂ should be selected to
provide the total load capacitance, C_L, specified by the crystal manufacturer. The total load capacitance is C_L = [(C₁ ×
C₂) / (C₁ + C₂)] + C_shunt, where C_shunt is the crystal shunt capacitance (C₀) specified by the crystal manufacturer plus
any mutual capacitance (C_pkg + C_PCB) seen across the AMIC110 RTC_XTALIN and RTC_XTALOUT signals. For
recommended values of crystal circuit components, see Table 6-5.
Figure 6-13. OSC1 (ZCZ Package) Crystal Circuit Schematic
100 Power and Clocking
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Copyright © 2016, Texas Instruments Incorporated