AMIC110 Datasheet, PDF (210/214 Pages) Texas Instruments – Sitara Processors

AMIC110
SPRS971A – AUGUST 2016 – REVISED SEPTEMBER 2016
9 Mechanical, Packaging, and Orderable Information
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NOTE
The ZCE package is not supported for this family of devices.
9.1 Via Channel
The ZCE package has been specially engineered with Via Channel technology. This allows larger than
normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the 0.65-
mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal layers
(four layers total) due to the increased layer efficiency of the Via Channel BGA technology.
9.2 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
210 Mechanical, Packaging, and Orderable Information
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