MC68HC08XL36 Datasheet, PDF (339/362 Pages) Freescale Semiconductor, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Specifications
Mechanical Specifications
L
48
49
33
32
–A–
L
–B–
B
V
DETAIL A
64
17
1
16
–D–
A
0.20 (0.008) M C A–B S D S
0.05 (0.002) A–B
S
0.20 (0.008) M H A–B S D S
E
M
DETAILC
C
–C–
SEATING H
PLANE
G
–H–
DATUM
PLANE
M
0.01 (0.004)
B
P
B
–A–, –B–, –D–
DETAIL A
F
J
N
BASE
D
METAL
0.02 (0.008) M C A–B S D S
–H– DATUM
PLANE
U
T
R
Q
K
W
X
DETAIL C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) PER SIDE.
TOTAL IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS
OR THE FOOT.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 13.90 14.10 0.547 0.555
B 13.90 14.10 0.547 0.555
C 2.15 2.45 0.085 0.096
D 0.30 0.45 0.012 0.018
E 2.00 2.40 0.079 0.094
F 0.30 0.40 0.012 0.016
G
0.80 BSC
0.031 BSC
H ––– 0.25 ––– 0.010
J 0.13 0.23 0.005 0.009
K 0.65 0.95 0.026 0.037
L
12.00 REF
0.472 REF
M
5 _{_} 10_{_} 5_{_} 10_{_}
N 0.13 0.17 0.005 0.007
P
0.40 BSC
0.016 BSC
Q 0_{_} 7_{_} 0_{_} 7_{_}
R 0.13 0.30 0.005 0.012
S 16.95 17.45 0.667 0.687
T 0.13 ––– 0.005 –––
U
0 _{_} –––
0_{_} –––
V 16.95 17.45 0.667 0.687
W 0.35 0.45 0.014 0.018
X
1.6 REF
0.063 REF
Figure 4. Case Outline Drawing 840b-01
19-spec_b
MOTOROLA
Specifications
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MC68HC08XL36
339