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MC68HC908EY16 Datasheet, PDF (245/278 Pages) Motorola, Inc – Microcontrollers | |||
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20.8 External Oscillator Characteristics
External Oscillator Characteristics
Characteristic(1)
Symbol
Min
Typ
Max
Unit
External clock option(2)(3)
With ICG clock disabled
With ICG clock enabled
EXTSLOW = 1(4)
EXTSLOW = 0(4)
dc(5)
â
32 M(6)
fEXTOSC
Hz
60
â
307.2 k
307.2 k
â
32 M(6)
External crystal options(7)(8)
EXTSLOW = 1(4)
EXTSLOW = 0(4)
fEXTOSC
30 k
1M
â
100 k
Hz
â
8M
Crystal load capacitance(9)
Crystal fixed capacitance(9)
Crystal tuning capacitance(9)
EXTSLOW = 1
Feedback bias resistor(9)
Series resistor (9)
CL
â
12.5
â
pF
C1
â
15
â
pF
C2
â
15
â
pF
RB
â
10
â
Mâ¦
Rs
100
330
470
kâ¦
EXTSLOW = 0
Feedback bias resistor(9)
Series resistor (9)(10)
fEXTOSC = 1 MHz
fEXTOSC = 4 MHz
fEXTOSC = 8 MHz
RB
â
1
â
Mâ¦
Rs
â
20
â
kâ¦
Rs
â
10
â
kâ¦
Rs
â
0
â
kâ¦
1. VDD = 4.5 to 5.5 Vdc, VSS = 0 Vdc, TA = â40°C to +135°C, unless otherwise noted
2. Setting EXTCLKEN configuration option enables OSC1 pin for external clock square-wave input.
3. No more than 10% duty cycle deviation from 50%
4. EXTSLOW configuration option configures external oscillator for a slow speed crystal and sets the clock monitor circuits
of the ICG module to expect an external clock frequency that is higher/lower than the internal oscillator base frequency,
fINTOSC.
5. Some modules may require a minimum frequency greater than dc for proper operation. See appropriate table for this
information.
6. MCU speed derates from 32 MHz at VDD = 4.5 Vdc
7. Setting EXTCLKEN and EXTXTALEN configuration options enables OSC1 and OSC2 pins for external crystal option.
8. fBus = (fEXTOSC / 4) when external clock source is selected.
9. Crystal manufacturerâs value, see Figure 8-3. Internal Clock Generator Block Diagram.
10. Not required for high-frequency crystals
MC68HC908EY16 ⢠MC68HC908EY8 Data Sheet, Rev. 10
Freescale Semiconductor
245
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