PIC24EP256GU810-I Datasheet, PDF (586/622 Pages) Electronic Film Capacitors, Inc. – 16-Bit Microcontrollers and Digital Signal Controllers with High-Speed PWM, USB and Advanced Analog

dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
e
E1
E
b
N
α
NOTE 1 _{1 2 3}
NOTE 2 A
c
β
φ
A2
A1
L
L1
Units
MILLIMETERS
Number of Leads
Lead Pitch
Overall Height
Dimension Limits
MIN
N
e
A
–
NOM
100
0.50 BSC
–
MAX
1.20
Molded Package Thickness
Standoff
Foot Length
A2
0.95
1.00
1.05
A1
0.05
–
0.15
L
0.45
0.60
0.75
Footprint
Foot Angle
Overall Width
L1
1.00 REF
φ
0°
3.5°
7°
E
16.00 BSC
Overall Length
Molded Package Width
Molded Package Length
D
16.00 BSC
E1
14.00 BSC
D1
14.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Notes:
Mold Draft Angle Bottom
β
11°
12°
13°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-110B
DS70616G-page 586
 2009-2012 Microchip Technology Inc.