PIC24EP256GU810-I Datasheet, PDF (500/622 Pages) Electronic Film Capacitors, Inc. – 16-Bit Microcontrollers and Digital Signal Controllers with High-Speed PWM, USB and Advanced Analog

dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
32.1 DC Characteristics
TABLE 32-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
Maximum MIPS
dsPIC33EPXXX(GP/MC/MU)806/810/
814 and PIC24EPXXX(GP/GU)810/814
—
—
Note 1:
2.95V-3.6V⁽¹⁾
-40°C to +85°C
70
2.95V-3.6V⁽¹⁾
-40°C to +125°C
60
Device is functional at VBORMIN < VDD < VDDMIN. Analog modules: ADC, Comparator and DAC will have
degraded performance. Device functionality is tested but not characterized. Refer to Parameter BO10 in
Table 32-11 for the minimum and maximum BOR values.
TABLE 32-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
I/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min. Typ. Max. Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+140
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 32-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ. Max. Unit Notes
Package Thermal Resistance, 64-pin QFN (9x9 mm)
JA
28
—
°C/W
1
Package Thermal Resistance, 64-pin TQFP (10x10 mm)
JA
47
—
°C/W
1
Package Thermal Resistance, 100-pin TQFP (12x12 mm)
JA
43
—
°C/W
1
Package Thermal Resistance, 100-pin TQFP (14x14 mm)
JA
43
—
°C/W
1
Package Thermal Resistance, 121-pin TFBGA (10x10 mm)
JA
40
—
°C/W
1
Package Thermal Resistance, 144-pin LQFP (20x20 mm)
JA
33
—
°C/W
1
Package Thermal Resistance, 144-pin TQFP (16x16 mm)
JA
33
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS70616G-page 500
 2009-2012 Microchip Technology Inc.