PIC24EP256GU810-I Datasheet, PDF (582/622 Pages) Electronic Film Capacitors, Inc. – 16-Bit Microcontrollers and Digital Signal Controllers with High-Speed PWM, USB and Advanced Analog

dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
123
NOTE 2
α
A
c
φ
A2
β
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
64
Lead Pitch
e
0.50 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
–
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
7°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
0.20
Lead Width
b
0.17
0.22
0.27
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-085B
DS70616G-page 582
 2009-2012 Microchip Technology Inc.