DS92UT16 Datasheet, PDF (1/111 Pages) Texas Instruments – DS92UT16TUF UTOPIA-LVDS Bridge for 1.6 Gbps Bi-directional Data Transfers

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DS92UT16
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SNOS992E – JANUARY 2002 – REVISED APRIL 2013
DS92UT16 UTOPIA-LVDS Bridge for 1.6 Gbps Bi-directional Data Transfers
Check for Samples: DS92UT16
FEATURES
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•23 832 Mbps LVDS 16-bit Serializer and
Deserializer Interface
– Suitable for Cable, Printed Circuit Board,
and Backplane Transmission Paths
– 10m Cable at Max LVDS Data Rate and
Greater than 16m at Min LVDS Data Rate
– Embedded Clock With Random Data Lock
Capability for Clock Recovery
– PRBS (x³¹ + x²⁸ + 1) Based LVDS Link BER
Test Facility
– Two Independent LVDS Receiver Serial
Ports for Optional 1:1 Protection
– Main and Redundant LVDS Transmit Ports
– Loop Timing Capability Enables LVDS
Recovered Clock to Internally Drive LVDS
Transmit Clock
– Internal Buffers Allow Maximum LVDS
Serial Bit Rate Independent of UTOPIA
Clock Rate
• Programmable UTOPIA Interface
– UTOPIA Level 2 Up To 52 MHz
– ATM Layer or PHY Layer Interface
– ATM Layer Interface Can Support Up To
248 Standard Level 2 PHY Ports With no
Additional External Circuitry. Configured as
31 MPHY’s, each With Up To 8 Sub-Ports
– Supports Extended Cell Size Up To 64
Bytes
– Supports 16- or 8-Bit Data Buses With
Parity
• Embedded Bidirectional, Non-Blocking Flow
Control Over Serial Link for per MPHY Back
Pressure
• No External Memories Required
• Embedded OAM Channel Over Serial Link
– Remote Alarm/Status Indications
– Link Trace Label
– Embedded Control Channel With Flow
Control for Software Communication
– BIP16 Based Error Performance Monitoring
– In Protected Systems, the Standby Link
OAM Channel is Available for Embedded
Communications and Performance/Alarm
Monitoring
• Multiple Loop-Back Options
• Standard Microprocessor Interface (Intel and
Motorola Compatible)
• IEEE 1149.1 JTAG^® Port
• Temperature Range: −40°C to +85°C
• CMOS Technology for Low Power
• LVDS Transceiver Section uses 3.3V Power
Supply. Digital UTOPIA Section uses 2.5V
Power Supply. All I/O are 3.3V Tolerant.
• 196 LBGA Package, 15x15x1.37 mm, 1.0 mm
Ball Pitch
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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