HD6413002 Datasheet, PDF (698/700 Pages) Renesas Technology Corp – High-performance single-chip microcontroller

Appendix F Package Dimensions
Figures F-1, F-2 and F-3 show the H8/3002 package dimensions.
16.0 ± 0.3
14
75
51
76
50
Unit: mm
100
1
0.22 ± 0.05
0.20 ± 0.04
26
25
0.08 M
1.0
0.10
1.0
0° – 8°
0.5 ± 0.2
Dimension including the plating thickness
Base material dimension
Figure F-1 Package Dimensions (FP-100B)
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