M1A3P1000-1PQ208M Datasheet, PDF (21/212 Pages) Microsemi Corporation – Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology

Military ProASIC3/EL Low Power Flash FPGAs
Thermal Characteristics
Introduction
The temperature variable in the Designer software refers to the junction temperature, not the ambient
temperature. This is an important distinction because dynamic and static power consumption cause the
chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
T_J = Junction Temperature = T + T_A
where:
T_A = Ambient Temperature
T = Temperature gradient between junction (silicon) and ambient T = _ja * P
_ja = Junction-to-ambient of the package. _ja numbers are located in Table 2-4.
P = Power dissipation
EQ 1
Package Thermal Characteristics
The device junction-to-case thermal resistivity is _jc and the junction-to-ambient air thermal resistivity is
_ja. The thermal characteristics for _ja are shown for two air flow rates. The recommended maximum
junction temperature is 125°C. EQ 2 shows a sample calculation of the recommended maximum power
dissipation allowed for a 484-pin FBGA package at military temperature and in still air.
Maximum Power Allowed = -M-----a---x---.---j-u---n---c---t--i-o---n-----t-e---m-----p---.----(_---^-_j-C_a---(-)-_---–C----/M--W----a-)-x---.---a---m-----b---i-e---n---t---t--e---m----p---.---(---^--C-----) = -1--2---25---0-^--.-C6---_--–-C----7/--W-0---^---C-- = 2.670
EQ 2
Table 2-4 • Package Thermal Resistivities
Package Type
Very Thin Quad Flat Pack (VQ100)
Plastic Quad Flat Pack (PQ208)*
Fine Pitch Ball Grid Array (FBGA)
* Embedded heatspreader
Device
A3P250
Pin Count _jc
100 10.0
Still Air
35.3
_ja
200 ft./min.
29.4
A3P1000
208
3.8 16.2
13.3
A3P1000
144
6.3 31.6
26.2
A3PE600L
484
9.5 27.5
21.9
A3PE3000L 484
4.7 20.6
15.7
A3PE3000L 896
2.4 13.6
10.4
500 ft./min. Units
27.1
C/W
11.9
C/W
24.2
C/W
20.2
C/W
14.0
C/W
9.4
C/W
Revision 3
2-7