M1A3P1000-1PQ208M Datasheet, PDF (169/212 Pages) Microsemi Corporation – Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology

Military ProASIC3/EL Low Power Flash FPGAs
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
User’s Guides
Military ProASIC3/EL Device Family User’s Guide
http://www.actel.com/documents/Mil_PA3_EL_UG.pdf
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Product Catalog
http://www.actel.com/documents/ProdCat_PIB.pdf
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
Package Mechanical Drawings
http://www.actel.com/documents/PckgMechDrwngs.pdf
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are at http://www.actel.com/products/solutions/package/docs.aspx.
Revision 3
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