MC9S12NE64CPVE Datasheet, PDF (504/554 Pages) Freescale Semiconductor, Inc – MC9S12NE64 Device Overview

Appendix A Electrical Characteristics
Table A-1. Absolute Maximum Ratings
Num
Rating
Symbol
Min
Max Unit
1 I/O, Regulator and Analog Supply Voltage
V_DD3
–0.3
4.5
V
2 Digital Logic Supply Voltage ¹
V_DD
–0.3
3.0
V
3 PLL Supply Voltage ¹
V_DDPLL
–0.3
3.0
V
4 Voltage difference V_DDX to V_DDR and V_DDA
5 Voltage difference V_SSX to V_SSR and V_SSA
∆_VDDX
∆_VSSX
–0.3
–0.3
0.3
V
0.3
V
6 Digital I/O Input Voltage
V_IN
–0.3
6.5
V
7 Analog Reference
V_RH, V_RL
–0.3
6.5
V
8 XFC, EXTAL, XTAL inputs
V_ILV
–0.3
3.0
V
9 TEST input
V_TEST
–0.3
10.0
V
Instantaneous Maximum Current
10 _{Single pin limit for all digital I/O pins 2}
I_D
–25
+25
mA
Instantaneous Maximum Current
11 _{Single pin limit for XFC, EXTAL, XTAL 3}
I_DL
–25
+25
mA
Instantaneous Maximum Current
12 _{Single pin limit for TEST 4}
I_DT
–0.25
0
mA
13 Operating Temperature Range (ambient)
T_A
–40
105 ⁵
°C
14 Operating Temperature Range (junction)
T_J
–40
140
°C
15 Storage Temperature Range
T_stg
–65
155
°C
1 _{The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The}
absolute maximum ratings apply when the device is powered from an external source.
2 _{All digital I/O pins are internally clamped to VSSX and VDDX, VDDR or VSSA and VDDA.}
3 _{These pins are internally clamped to VSSPLL and VDDPLL.}
4 _{This pin is clamped low to VSSPLL, but not clamped high. This pin must be tied low in applications.}
5 _{Maximum ambient temperature is package dependent.}
A.6 ESD Protection and Latch-Up Immunity
All ESD testing is in conformity with CDF-AEC-Q100 stress test qualification for automotive
grade integrated circuits. During the device qualification ESD stresses were performed for the
human body model (HBM), the machine model (MM), and the charge device model.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the
device specification. Complete DC parametric and functional testing is performed per the
applicable device specification at room temperature followed by hot temperature, unless specified
otherwise in the device specification.
MC9S12NE64 Data Sheet, Rev. 1.1
504
Freescale Semiconductor