C8051F80X_14 Datasheet, PDF (36/251 Pages) Silicon Laboratories – Mixed Signal ISP Flash MCU Family

C8051F80x-83x
Figure 5.2. QSOP-24 PCB Land Pattern
Table 5.2. QSOP-24 PCB Land Pattern Dimensions
Dimension
Min
C
5.20
E
0.635 BSC
X
0.30
Y
1.50
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
Max
5.30
0.40
1.60
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
pad is to be 60 µm minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
Card Assembly
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
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Rev. 1.0