JN517X Datasheet, PDF (87/100 Pages) NXP Semiconductors – Supports multiple network stacks

NXP Semiconductors
JN517x
IEEE802.15.4 Wireless Microcontroller
17. Package outline
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
SOT618-8
D
terminal 1
index area
BA
E
A _A1
c
detail X
11
L
10
e₁
e
1/2 e
b
v CAB
wC
20
21
y₁ C
C
y
e
E_h
e₂
1/2 e
1
30
terminal 1
40
31
index area
D_h
X
Dimensions
0
2.5
5 mm
scale
Unit
A⁽¹⁾ A₁ b
c D⁽¹⁾ D_h E⁽¹⁾ E_h e e₁ e₂ L
v
w
y y₁
max 1.00 0.05 0.30
6.1 4.85 6.1 4.85
0.5
mm nom 0.85 0.02 0.21 0.2 6.0 4.70 6.0 4.70 0.5 4.5 4.5 0.4 0.1 0.05 0.05 0.1
min 0.80 0.00 0.18
5.9 4.55 5.9 4.55
0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
European
projection
SOT618-8
MO-220
---
Fig 58. Package outline SOT618-8 HVQFN40
sot618-8_po
Issue date
13-11-19
14-01-16
JN517X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.0 — 8 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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