JN517X Datasheet, PDF (85/100 Pages) NXP Semiconductors – Supports multiple network stacks

NXP Semiconductors
JN517x
IEEE802.15.4 Wireless Microcontroller
specification defines the physical packaging characteristics and land patterns for a range
of surface-mounted devices. IPC782 is also a useful reference document for general
surface mount design techniques, containing sections on design requirements, reliability
and testability. NXP strongly recommends that this be referred to when designing the
PCB.
NXP also provides an Application Note AN10366, “HVQFN application information”, which
describes the reflow soldering process, refer also to Section 18.
15.1.4 Moisture sensitivity level (MSL)
If there is moisture trapped inside a package, and the package is exposed to a reflow
temperature profile, the moisture may turn into steam, which expands rapidly. This may
cause damage to the inside of the package (delamination), and it may result in a cracked
semiconductor package body (the popcorn effect). A package’s MSL depends on the
package characteristics and on the temperature it is exposed to during reflow soldering,
refer also to Section 18.
Depending on the damage after this test, an MSL of 1 (not sensitive to moisture) to 6 (very
sensitive to moisture) is attached to the semiconductor package.
JN517X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.0 — 8 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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