JN517X Datasheet, PDF (86/100 Pages) NXP Semiconductors – Supports multiple network stacks

NXP Semiconductors
JN517x
IEEE802.15.4 Wireless Microcontroller
16. Footprint information for reflow soldering
Footprint information for reflow soldering of HVQFN40 package
Hx
Gx
D
C
0.105
Hy
Gy
nSPx
nSPy
SPx
SPy
0.125
SOT618-8
SLy By Ay
SPx tot
X
SLx
Bx
Ax
0.29
0.24
0.85 0.9
solder land
solder paste deposit
Dimensions in mm
P
Ax
Ay
Bx
0.5
7.0 7.0 5.2
Issue date
15-04-29
15-04-30
solder land plus solder paste
occupied area
detail X
nSPx nSPy
3
3
Recommended stencil thickness: 0.1 mm
By
C
D
Gx Gy Hx
Hy SLx SLy SPx SPy SPx tot SPy tot
5.2 0.9 0.29 6.3 6.3 7.25 7.25 4.7 4.7 0.7 0.7
2.7
2.7
sot618-8_fr
Fig 57. Reflow soldering information for the HVQFN40 package
JN517X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2.0 — 8 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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