JN517X Datasheet, PDF (84/100 Pages) NXP Semiconductors – Supports multiple network stacks

NXP Semiconductors
JN517x
IEEE802.15.4 Wireless Microcontroller
Table 38. Components
Component Function
Value
C13
VB Dig decoupling
100 nF
C14
crystal load capacitance 12 pF  5 % COG
C16
power source decoupling 10 F
L1
RF matching inductor 4.3 nH
L2
load inductor
3 nH
R1
IBIAS resistor
Y1
crystal
43 k 1%
32 MHz; C_L = 9 pF
Remarks
locate less than 5 mm from IC1 pin 35
adjacent to pin 5 and Y1 pin 1
[1] _{Murata LQP15MN4N3B02 can be used up to 85 °C;}
Murata LQG15MN4N3B02 can be used up to 125 °C
[1] _{Murata LQP15MN3N0B02 can be used up to 85 °C;}
Murata LQG15MN3N0B02 can be used up to 125 °C
AEL X32M000000S039 or
NDK NX3225SA EXS00A-CS08207 or NX2016SA
32 MHz EXS00A-CS07977 or
Murata XR16GD32M000KYQ01R0 (2016) or
Epson Toyocom X1E000021016700
[1] Must be copied directly from the reference design.
The paddle should be connected directly to ground. Any pads that require connection to
ground should do so by connecting directly to the paddle.
15.1.2 Application diagram with Pi filter
Extra pi filter is recommended on RF path to insure a successful FCC certification
regarding H2 spurs. This is the implemented solution for the NXP modules available on
the market.
IBIAS
R1
43 kΩ
To coaxial socket
or integrated antenna
L4
50 ohms line
2.7 nH
C18
1.2 pF
L2
1.5 nH
C3
100 nF
L1
3.9 nH
C1
1.2 pF
C2
1.8 pF
Fig 56. Application diagram with Pi filter
C4
47 pF
aaa-022076
15.1.3 PCB design and reflow profile
PCB and land pattern designs are key to the reliability of any electronic circuit design.
JN517X
Product data sheet
The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a
number of standards for electronic devices. One of these is the "Surface Mount Design
and Land Pattern Standard" IPC-SM-782 commonly referred to as “IPC782". This
All information provided in this document is subject to legal disclaimers.
Rev. 2.0 — 8 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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