MC68HC05V12 Datasheet, PDF (240/246 Pages) Freescale Semiconductor, Inc – HCMOS Microcontreller Unit

Freescale Semiconductor, Inc.
Mechanical Specifications
18.3 68-Lead Plastic Leaded Chip Carrier (PLCC)
–N–
Y BRK
D
B
0.007 M T L–M S N S
U 0.007 ^M T L–M ^S N ^S
Z
–L–
–M–
68
1
W
D
V
X
VIEW D–D
G1
0.010 S T L–M S N S
A
Z
R
0.007 M T L–M S N S
0.007 M T L–M S N S
C
G
G1
E
0.004
J
–T– SEATING
PLANE
VIEW S
0.010 S T L–M S N S
H 0.007 M T L–M S N S
K1
K
F
VIEW S
0.007 M T L–M S N S
.
NOTES:
1. DATUMS L, M, AND N DETERMINED WHERE TOP OF LEAD
SHOULDER EXITS PLASTIC BODY AT MOLD PARTING
LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012. DIMENSIONS R AND
U ARE DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE
BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP AND
BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037. THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025.
INCHES
DIM MIN MAX
A 0.985 0.995
B 0.985 0.995
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 –––
K 0.025 –––
R 0.950 0.956
U 0.950 0.956
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y ––– 0.020
Z
2 _ 10_
G1 0.910 0.930
K1 0.040 –––
Technical Data
Mechanical Specifications
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MC68HC05V12 — Rev. 2.0