LAN9730 Datasheet, PDF (214/222 Pages) SMSC Corporation – High-Speed Inter-Chip (HSIC) USB 2.0

LAN9730/LAN9730i
56L Very Thin Quad Flat, No Lead Package (RT) - 8x8 mm Body [VQFN]
With 5.9x5.9 mm Exposed Pad; Punch Singulated
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
Units
Dimension Limits
Number of Terminals
N
Pitch
e
Overall Height
A
Standoff
A1
Mold Cap Thickness
A2
Overall Length
D
Molded Top Length
D1
Exposed Pad Length
D2
Overall Width
E
Molded Top Width
E1
Exposed Pad Width
E2
Terminal Width
b
Terminal Length
L
Terminal-to-Exposed-Pad
K
MILLIMETERS
MIN
NOM
MAX
56
0.50 BSC
0.70
0.85
1.00
0.00
0.02
0.05
-
-
0.90
8.00 BSC
7.65
7.75
7.85
5.80
5.90
6.00
8.00 BSC
7.65
7.75
7.85
5.80
5.90
6.00
0.18
0.23
0.30
0.30
0.40
0.50
0.20
-
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is punch singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-375A Sheet 2 of 2
DS00001946A-page 214
 2012-2015 Microchip Technology Inc.