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| LAN9730 Datasheet, PDF (11/222 Pages) SMSC Corporation – High-Speed Inter-Chip (HSIC) USB 2.0 | |||
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LAN9730/LAN9730i
2.0 PIN DESCRIPTION AND CONFIGURATION
FIGURE 2-1:
PIN ASSIGNMENTS (TOP VIEW)
nPHY_INT 1
TXN 2
TXP 3
VDD33A 4
RXN 5
RXP 6
EXRES 7
VDD33A 8
VDD12PLL 9
HSIC_DATA 10
HSIC_STROBE 11
VDD12A 12
TEST2 13
TXER 14
LAN9730
56-PIN VQFN
(TOP VIEW)
VSS
42 RXDV
41 RXCLK
40 TDI/RXD3
39 TMS/RXD2
38 TCK/RXD1
37 TDO/nPHY_RST
36 nTRST/RXD0
35 VDD33IO
34 PHY_SEL
33 TEST1
32 EEDI
31 EEDO/AUTOMDIX_EN
30 EECS
29 EECLK
Note:
Note:
Note:
Note:
** This pin provides additional PME related functionality. Refer to the respective pin descriptions and Chapter
5.0, "PME Operation" for additional information.
*** GPIO7 may provide additional PHY Link Up related functionality. Refer to Section 4.12.2.4, "Enabling
External PHY Link Up Wake Events" for additional information.
When HP Auto-MDIX is activated, the TXN/TXP pins can function as RXN/RXP and vice-versa.
Exposed pad (VSS) on bottom of package must be connected to ground.
ï£ 2012-2015 Microchip Technology Inc.
DS00001946A-page 11
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