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| PIC18F23K22 Datasheet, PDF (491/492 Pages) Microchip Technology – 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology | |||
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PIC18(L)F2X/4XK22
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Packaging
Option
-
X
Temperature
Range
/XX
Package
XXX
Pattern
Device:
PIC18F46K22, PIC18LF46K22
PIC18F45K22, PIC18LF45K22
PIC18F44K22, PIC18LF44K22
PIC18F43K22, PIC18LF43K22
PIC18F26K22, PIC18LF26K22
PIC18F25K22, PIC18LF25K22
PIC18F24K22, PIC18LF24K22
PIC18F23K22, PIC18LF23K22
Examples:
a) PIC18F46K22-E/P 301 = Extended temp.,
PDIP package, QTP pattern #301.
b) PIC18F46K22-I/SO = Industrial temp., SOIC
package.
c) PIC18F46K22-E/P = Extended temp., PDIP
package.
d) PIC18F46K22T-I/ML = Tape and reel,
Industrial temp., QFN package.
Packaging
Option:
Temperature
Range:
blank = standard packaging (tube or tray)
T = Tape and Reel(1)
E
= -40ï°C to +125ï°C (Extended)
I
= -40ï°C to +85ï°C (Industrial)
Note 1:
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
Package:
ML = QFN
MV = UQFN
P = PDIP
PT = TQFP (Thin Quad Flatpack)
SO = SOIC
SP = Skinny Plastic DIP
SS = SSOP
Pattern:
QTP, SQTP, Code or Special Requirements
(blank otherwise)
ï£ 2010 Microchip Technology Inc.
Preliminary
DS41412B-page 491
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