PIC18F23K22 Datasheet, PDF (426/492 Pages) Microchip Technology – 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology

PIC18(L)F2X/4XK22
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
PIC18F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Device Characteristics
Typ Typ Max Max
+25°C +60°C +85°C +125°C
Units
VDD
Conditions
Notes
D017 DAC
12
20
20
A _1.8V
20
30
30
A _3.0V
12
20
20
A _1.8V
20
30
30
A _3.0V
33
50
50
A _5.0V
D018 FVR
15
25
25
A _1.8V
15
25
25
A _3.0V
30
45
45
A _1.8V
35
55
55
A _3.0V
70
100 100
A _5.0V
Note 1:
2:
3:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
DS41412B-page 426
Preliminary
 2010 Microchip Technology Inc.