AMD-K6 Datasheet, PDF (248/346 Pages) Advanced Micro Devices – AMD-K6 Processor

AMD-K6^® Processor Data Sheet
Preliminary Information
20695H/0—March 1998
0.254mm (min.) for
isolation region
C5
C18 C17 C20
C6
C19 C21
C7
+ ^C1
+ ^CC3
C22
C23
+ CC4
C24
C11
C2
+
+ ^CC5
C25
CC6
C29
C12
C27 C30
C13
C26 C28 C31
13.2
V_CC3 (I/O) Plane
V_CC2 (Core) Plane
CC1
CC2
Figure 79. Suggested Component Placement
Decoupling Recommendations
In addition to the isolation region mentioned in “Power
Connections” on page 229, adequate decoupling capacitance is
required between the two system power planes and the ground
plane to minimize ringing and to provide a low-impedance path
for return currents. Suggested decoupling capacitor placement
is shown in Figure 79.
Surface mounted capacitors should be used under the
processor’s ZIF socket to minimize resistance and inductance in
the lead lengths while maintaining minimal height. For
information and recommendations about the specific value,
quantity, and location of the capacitors, see the AMD-K6^®
Processor Power Supply Design Application Note, order# 21103.
230
Power and Grounding
Chapter 13