PIC24FJ256DA210 Datasheet, PDF (372/408 Pages) Microchip Technology – 64/100-Pin, 16-Bit Flash Microcontrollers with Graphics Controller and USB On-The-Go (OTG)

PIC24FJ256DA210 FAMILY
30.1 DC Characteristics
FIGURE 30-1:
PIC24FJ256DA210 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
3.6V
2.2V
VBOR
PIC24FJXXXDA1
3.6V
2.2V
VBOR
Note:
Frequency
VCAP (nominal On-Chip Regulator output voltage) = 1.8V.
32 MHz
TABLE 30-1: THERMAL OPERATING CONDITIONS
Rating
PIC24FJ256DA210 family:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation (with ENVREG = 1):
Internal Chip Power Dissipation: PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
PD
PINT + PI/O
W
PDMAX
(TJMAX – TA)/JA
W
TABLE 30-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ
Max
Unit Note
Package Thermal Resistance, 12x12x1 mm TQFP
JA
69.4
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP
JA
76.6
—
°C/W (Note 1)
Package Thermal Resistance, 9x9x0.9 mm QFN
JA
28.0
—
°C/W (Note 1)
Package Thermal Resistance, 10x10x1.1 mm BGA
JA
40.2
—
°C/W (Note 1)
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
DS39969B-page 372
 2010 Microchip Technology Inc.