K4Y50164UC Datasheet, PDF (74/76 Pages) Samsung semiconductor – 512Mbit XDR TM DRAM(C-die)

K4Y50164UC
K4Y50084UC
K4Y50044UC
K4Y50024UC
XDR^TM DRAM
List of Tables
Table 1-1. x16 Package Pinout(Top View) : 104ball FBGA Package .................................................................................................... 6
Table 1-2. x8 Package Pinout(Top View) : 104ball FBGA Package .................................................................................................... 7
Table 1-3. x4 Package Pinout(Top View) : 104ball FBGA Package .................................................................................................... 8
Table 1-4. x2 Package Pinout(Top View) : 104ball FBGA Package .................................................................................................... 9
Table 2. Pin Description ......................................................................................................................................................................... 10
Table 3. Request Field Description ....................................................................................................................................................... 13
Table 4. OP Field Encoding Summary .................................................................................................................................................. 15
Table 5. ROP Field Encoding Summary................................................................................................................................................ 15
Table 6. POP Field Encoding Summary ................................................................................................................................................ 16
Table 7. XOP Field Encoding Summary. ............................................................................................................................................... 16
Table 8. Packet Interaction Summary ................................................................................................................................................... 17
Table 9. SCMD Field Encoding Summary ............................................................................................................................................. 34
Table 10. Initialization Timing Parameters............................................................................................................................................ 48
Table 11. XDR DRAM WDSL-to-Core/DQ/SC Map (First Generation x16/x8/x4/x2 XDR DRAM, BL=16).......................................... 49
Table 12. Core Data Word-to-WDSL Format ......................................................................................................................................... 49
Table 13. Electrical Conditions .............................................................................................................................................................. 57
Table 14. Timing Conditions .................................................................................................................................................................. 58
Table 15. Electrical Characteristics....................................................................................................................................................... 59
Table 16. Supply Current Profile............................................................................................................................................................ 59
Table 17. Timing Characteristics ........................................................................................................................................................... 60
Table 18. Timing Parameters ................................................................................................................................................................. 61
Table 19. Package RSL Parasitic Summary.......................................................................................................................................... 70
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Rev. 1.1 August 2006