K4Y50164UC Datasheet, PDF (72/76 Pages) Samsung semiconductor – 512Mbit XDR TM DRAM(C-die)

K4Y50164UC
K4Y50084UC
K4Y50044UC
K4Y50024UC
XDR^TM DRAM
15.2 Package Dimensions (104-Ball FBGA) (Unit : mm)
MOLDING AREA
14.00 ± 0.10
12.00
0.80
2.00
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
(Datum B) C
D
E
F
G
H
J
K
L
A
#A1 INDEX MARK
B
104- ∅0.45 Solder ball
( Post reflow 0.50 + 0.05 )
0.2 M A B
(Datum A)
14.00 ± 0.10
#A1
0.35 ± 0.05
1.03 ± 0.10
72 of 76
Rev. 1.1 August 2006