MC68HC08AZ32A Datasheet, PDF (436/456 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Electrical Specifications
24.14 Mechanical Specifications
24.14.1 64-pin Quad Flat Pack (QFP)
L
48
49
33
32
-A-
L
-B-
B
V
B
B
P
- A, B, D -
Detail “A”
F
E
C
-C-
Seating
Plane
Detail “A”
64
17
1
16
-D-
A
0.20 M C A – B S D S
0.05 A – B
S
0.20 M H A – B S D S
Detail “C”
M
J
N
D
Section B–B
Base
Metal
0.20 M C A – B S D S
U
T
R
H
G
-H-
Datum
Plane
M
Q
K
W
X
Dim. Min. Max.
Notes
Dim. Min. Max.
A
13.90 14.10 _{1. Datum Plane –H– is located at bottom of lead and is coincident with} M
5°
10 °
B
13.90 14.10
the lead where the lead exits the plastic body at the bottom of the _N
0.13 0.17
C
2.15
2.45
parting line.
2. Datums A–B and –D to be determined at Datum Plane –H–.
P
0.40 BSC
D
0.30 0.45 _{3. Dimensions S and V to be determined at seating plane –C–.}
Q
0°
7°
E
2.00 2.40 ^{4. Dimensions A and B do not include mould protrusion. Allowable}
R
0.13 0.30
F
0.30 0.40
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
S
16.95 17.45
G
0.80 BSC
5. Dimension D does not include dambar protrusion. Allowable
T
0.13 —
H
—
0.25
dambar protrusion shall be 0.08 total in excess of the D dimension _U
0°
—
J
0.13 0.23
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
V
16.95 17.45
K
0.65 0.95 _{6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.}
W 0.35 0.45
L
12.00 REF ^{7. All dimensions in mm.}
X
1.6 REF
Technical Data
436
Figure 24-3. 64-pin QFP (Case #840B)
MC68HC08AZ32A — Rev 1.0
Electrical Specifications
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