MC68HC908KX8 Datasheet, PDF (291/310 Pages) Motorola, Inc – Microcontrollers

Technical Data — MC68HC908KX8 • MC68HC908KX2 • MC68HC08KX8
Section 21. Mechanical Specifications
21.1 Contents
21.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 291
21.3 16-Pin Plastic Dual In-Line Package (PDIP). . . . . . . . . . . . . .292
21.4 16-Pin Small Outline Package (SOIC) . . . . . . . . . . . . . . . . . .292
21.2 Introduction
This section gives the dimensions for:
• 16-pin plastic dual in-line package (case number 648D)
• 16-pin small outline package (case number 751G)
The following figures show the latest package drawings at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
• Local Motorola Sales Office
• Worldwide Web (wwweb) at
http://www.motorola.com/semiconductors/
Follow Worldwide Web on-line instructions to retrieve the current
mechanical specifications.
MC68HC908KX8 • MC68HC908KX2 • MC68HC08KX8 — Rev. 1.0
MOTOROLA
Mechanical Specifications
Technical Data
291