ZAMC4100 Datasheet, PDF (148/155 Pages) Integrated Device Technology – Actuator and Motor Controller

ZAMC4100 Datasheet
7 Multi-chip Module Assembly, Pin Layout, and Pin Assignments
ZAMC4100 is a highly integrated solution consisting of Microcontroller Unit (MCU) and System Basis Chip (SBC)
within a single plastic QFN package as shown below. Both chips are assembled in a multi-chip-package placed
horizontally alongside one another. The exposed pad allows better thermal performance.
Figure 7.2 gives the pin layout and assignments. See Table 7.1 for the description of the pins.
Figure 7.1 ZAMC4100 Multi-chip-Module Assembly
External pin bonding wires
Off-chip bonding wires
SBC
MCU
Exposed pad
Figure 7.2 Pin Layout for ZAMC4100 PQFN65 – Top View
HB2a 1
VSS3 2
HB1b 3
VDDE2 4
VDDE3 5
HS1a 6
VDDE4 7
VDDE5 8
HS2 9
HS1b 10
VDDE6 11
VDDE7 12
HB1a 13
HS3 14
VSS2 15
HB2b ₁₆
EXPOSED PAD
(pin 65)
48 TCK
47 TMS
46 TDO
45 TDI
44 GPIO0
43 GPIO1
42 GPIO2
41 GPIO3
40 GPIO4
39 GPIO5
38 GPIO6
37 GPIO7
36 n.c.
35 CAP_MCU
34 CAP_3V3
33 CAP_1V8
© 2016 Integrated Device Technology, Inc.
148
January 26, 2016