ZAMC4100 Datasheet, PDF (14/155 Pages) Integrated Device Technology – Actuator and Motor Controller

ZAMC4100 Datasheet
1 IC Characteristics
1.1. Absolute Maximum Ratings
Stresses above those listed in this clause may cause immediate and permanent device failure. It is not implied
that more than one of these conditions can be applied simultaneously. Operation outside the operating ranges for
extended periods may affect device reliability. Total cumulative dwell time above the maximum operating rating
for power supply or temperature must be less than 100 hours.
Table 1.1 Absolute Maximum Ratings
Parameter
Supply Voltage
System supply voltage
System supply voltage under transient conditions
Input Pin Voltage
AIN1-4
GPIO0-7
LIN Bus Voltage
Bus voltage
Transient input voltage (per ISO7637 Specification)
GPIO Supply current
Total GPIO sink/source current (referenced to 3.3V)
Symbol
VVDDE
VVDDE_max
VIN(ANALOG)
VIN(MCU)
VBUS(SS)
VBUS(PK)
IGPIO
Value
-0.3 to 28
-0.3 to 40
-0.3 to 5.5
-0.3 to 3.6
-18 to 40
-150 to 100
5
UNIT
V
V
V
V
V
V
mA
Table 1.2 Thermal Specifications
Parameter
Symbol
Value
UNIT
Thermal Ratings
Operating ambient temperature
Operating junction temperature ^{1), 2)}
TA
-40 to 85
˚C
TJ
-40 to 125
˚C
Storage temperature
TSTG
-40 to 150
˚C
Thermal Characteristics
Thermal resistance junction to case ^3),4)
Thermal resistance junction to ambient ^3),4)
ΘJC
0.4
˚C/W
ΘJA
21
˚C/W
1) The limiting factor is the operating temperature of the FLASH memory within the MCU where the data retention is guaranteed for temperatures up to
85˚C. In order to keep the MCU temperature below 85˚C when the SBC is running at maximum temperature, the application should provide a sufficient
heat sink. For more information, contact IDT technical support.
2) The device will automatically shut down the drivers at 125°C.
3) IDT uses test boards in conformance with the JESD51-7 (JEDEC) for thermal impedance measurement.
4) This value applies for the JEDEC board profile and specific environment only for package performance comparison. Care should be taken when apply-
ing in the actual application where the printed circuit board (PCB) profile and environment are different. Contact IDT technical support for assistance.
© 2016 Integrated Device Technology, Inc.
14
January 26, 2016