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XQ2V1000_1 Datasheet, PDF (13/134 Pages) Xilinx, Inc – QPro Virtex-II 1.5V Platform FPGAs
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QPro Virtex-II 1.5V Platform FPGAs
X-Ref Target - Figure 9
Bank 1
Bank 0
Bank 4
Bank 5
ds031_66_112900
Figure 9: Virtex-II I/O Banks: Top View for Flip-Chip
Packages (FF & BF)
VREF pins within a bank are interconnected internally, and
consequently only one VREF voltage can be used within
each bank. However, for correct operation, all VREF pins in
the bank must be connected to the external reference
voltage source.
The VCCO and the VREF pins for each bank appear in the
device pinout tables. Within a given package, the number of
VREF and VCCO pins can vary depending on the size of
device. In larger devices, more I/O pins convert to VREF
pins. Since these are always a superset of the VREF pins
used for smaller devices, it is possible to design a PCB that
permits migration to a larger device if necessary.
All VREF pins for the largest device anticipated must be
connected to the VREF voltage and are not used for I/O. In
smaller devices, some VCCO pins used in larger devices do
not connect within the package. These unconnected pins
can be left unconnected externally, or, if necessary, they can
be connected to VCCO to permit migration to a larger device.
Rules for Combining I/O Standards in the Same Bank
The following rules must be obeyed to combine different
input, output, and bidirectional standards in the same bank:
• Combining output standards only. Output standards
with the same output VCCO requirement can be
combined in the same bank.
Compatible example:
SSTL2_I and LVDS_25_DCI outputs
Incompatible example:
SSTL2_I (output VCCO = 2.5V) and
LVCMOS33 (output VCCO = 3.3V) outputs
• Combining input standards only. Input standards
with the same input VCCO and input VREF requirements
can be combined in the same bank.
Compatible example:
LVCMOS15 and HSTL_IV inputs
Incompatible example:
LVCMOS15 (input VCCO = 1.5V) and
LVCMOS18 (input VCCO = 1.8V) inputs
Incompatible example:
HSTL_I_DCI_18 (VREF = 0.9V) and
HSTL_IV_DCI_18 (VREF = 1.1V) inputs
• Combining input standards and output standards.
Input standards and output standards with the same
input VCCO and output VCCO requirement can be
combined in the same bank.
Compatible example:
LVDS_25 output and HSTL_I input
Incompatible example:
LVDS_25 output (output VCCO = 2.5V) and
HSTL_I_DCI_18 input (input VCCO = 1.8V)
• Combining bidirectional standards with input or
output standards. When combining bidirectional I/O
with other standards, make sure the bidirectional
standard can meet rules 1 through 3 above.
• Additional rules for combining DCI I/O standards.
♦ No more than one Single Termination type (input or
output) is allowed in the same bank.
Incompatible example:
HSTL_IV_DCI input and HSTL_III_DCI input
♦ No more than one Split Termination type (input or
output) is allowed in the same bank.
Incompatible example:
HSTL_I_DCI input and HSTL_II_DCI input
The implementation tools enforce these design rules.
DS122 (v2.0) December 21, 2007
www.xilinx.com
Product Specification
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