W83627DHG Datasheet, PDF (45/268 Pages) Winbond – WINBOND LPC I/O

W83627DHG
Eight-bit temperature data is read from Index[27h]. For nine-bit temperature data, the 8 MSB are read
from Bank1 / Bank2 Index[50h], and the LSB is read from Bank1 / Bank2 Index[51h], bit 7.
There are two sources of temperature data: external thermistors or thermal diodes.
7.3.3.1. Monitor Temperature From Thermistor
External thermistors should have a β value of 3435K and a resistance of 10 KΩ at 25°C. As illustrated
in the schematic below, the thermistor is connected in series with a 10-KΩ resistor and then connects
to VREF (pin 101).
RTHM
10K@25 C, beta=3435K
R
10K, 1%
VREF
AUXTIN
CPUTIN
SYSTIN
Pin 101
Pin 102
Pin 103
Pin 104
W83627DHG
7.3.3.2. Monitor Temperature from Thermal Diode (Voltage Mode)
The thermal diode D- pin is connected to CPUD-(pin 105), and the D+ pin is connected to the
temperature sensor pin in the W83627DHG. A 15-KΩ resistor is connected to VREF to supply the bias
current for the diode, and the 2200-pF, bypass capacitor is added to filter high-frequency noise.
R=15K,1%
D+
Therminal
Diode
D-
C=2200pF
AGND
VREF
W83627DHG
(SYSTIN)
CPUTIN
(AUXTIN)
CPUD-(AGND)
Publication Release Date: Aug, 22, 2007
-33-
Version 1.4