W83627DHG Datasheet, PDF (267/268 Pages) Winbond – WINBOND LPC I/O

W83627DHG
23. PACKAGE SPECIFICATION
102
103
HE
E
65
64
D HD
128
1
e
39
38
b
See Detail F
Seating Plane
A
A2
A1
y
c
L
L₁
Detail F
Symbol
A1
A2
Min
0.25
2.57
Dimension in mm
Nom
0.35
Max
0.45
2.72
2.87
b
0.10
0.20
0.30
c
0.10
0.15
0.20
D
13.90
14.00
14.10
E
19.90
20.00
20.10
e
0.50
HD
17.00
17.20
17.40
HE
23.00
23.20
23.40
L
0.65
0.80
0.95
L1
1.60
y
0.08
0
0
7
Dimension in inch
Min Nom Max
0.010 0.014 0.018
0.101 0.107 0.113
0.004 0.008 0.012
0.004 0.006 0.008
0.547 0.551 0.555
0.783 0.787 0.791
0.020
0.669 0.677 0.685
0.905 0.913 0.921
0.025 0.031 0.037
0.063
0.003
0
7
Note:
1.Dimension D & E do not include interlead
flash.
2.Dimension b does not include dambar
protrusion/intrusion .
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
on final visual inspection spec.
5. PCB layout please use the "mm".
128-pin (QFP)
-255-
Publication Release Date: Aug, 22, 2007
Version 1.4