W83627DHG Datasheet, PDF (266/268 Pages) Winbond – WINBOND LPC I/O

22. TOP MARKING SPECIFICATION
W83627DHG
inbond
W83627DHG
606G9C28201234UB
1st line: Winbond logo
2nd line: part number: W83627DHG (Pb-free package)
3rd line: tracking code 606G9C28201234UB
606: packages made in '06, week 06
G: assembly house ID; G means GR, A means ASE, etc.
9: code version; 9 means code 009
C: IC revision; A means version A; B means version B, and C means version C
28201234: wafer production series lot number
UB: Winbond internal use.
-254-
Publication Release Date: Aug, 22, 2007
Version 1.4