W83627DHG Datasheet, PDF (122/268 Pages) Winbond – WINBOND LPC I/O

W83627DHG
MODE
1
2
3
4
5
6
7
8
9
a
b
DEFINITION
CMD
CMD_Da(1)
CMD_Da(2)
CMD_Add(3)
CMD_Ad(3)_Da(1)_W
CMD_Ad(3)_Da(4)_W
CMD_Ad(4)_Da(4)_R
CMD_Ad(3)_Da(1)_R
CMD_Ad(3)_Da(2)_R
CMD_Ad(3)_Da(3)_R
CMD_Ad(3)_Da(4)_R
Table 9.3 MODE
FUNCTION
Command only
Command with 1byte data write
Command with 2bytes data read
Command with 3 bytes address
Command with 3bytes address and
1byte data read
Command with 3bytes address and
4bytes data write
Command with 3bytes and a
dummy byte address and 4byte
data read
Command with 3bytes address and
1byte data read
Command with 3bytes address and
2bytes data read
Command with 3bytes address and
3bytes data read
Command with 3bytes address and
4 bytes data read
COMMAND EXAMPLE
Chip Enable, Write
Enable, Write Disable
Write Status Register
Read ID (Atmel^®)
Block Erase, Sector Erase
Byte Program (1 byte)
Page Program (4 bytes)
FAST READ (4 bytes)
READ, Read Status
Read ID (ST/SST^®)
Read ID (Winbond ^®)
Read ID (PMC^®)
„ Reading Data From SPI Devices
First, write the “Read” instruction to Base+0. Then write the addresses to Base+2 ~
Base+3. Last, write 8X to Base+1.
„ Programming SPI Devices
First, write the “Byte Program” instruction to Base+0. Then write the addresses into
Base+2 ~ Base+3 and parameters to Base+4. Last, write 5X to Base+1. For correct
programming, make sure the state of the device is ready and write enabled.
* For more details, please see the Programming Guide of the W83627DHG.
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Publication Release Date: Aug, 22, 2007
Version 1.4