W83627DHG Datasheet, PDF (12/268 Pages) Winbond – WINBOND LPC I/O

W83627DHG
20.7 Logical Device 6 (Serial Peripheral Interface)..................................................................... 194
20.8 Logical Device 7 (GPIO6) ................................................................................................... 195
20.9 Logical Device 8 (WDTO# & PLED) ................................................................................... 196
20.10 Logical Device 9 (GPIO2, GPIO3, GPIO4, GPIO5) ............................................................ 198
20.11 Logical Device A (ACPI)...................................................................................................... 202
20.12 Logical Device B (Hardware Monitor) ................................................................................. 210
20.13 Logical Device C (PECI, SST) ............................................................................................ 212
21. SPECIFICATIONS ........................................................................................................................ 216
21.1 Absolute Maximum Ratings ................................................................................................ 216
21.2 DC CHARACTERISTICS .................................................................................................... 216
21.3 AC CHARACTERISTICS .................................................................................................... 225
21.3.1 AC Power Failure Resume Timing .......................................................................................225
21.3.2 VSBGATE# Timing – for UBE and UBF Version Only .........................................................230
21.3.3 Clock Input Timing ...............................................................................................................231
21.3.4 PECI and SST Timing ..........................................................................................................232
21.3.5 SPI Timing ...........................................................................................................................233
21.3.6 SMBus Timing......................................................................................................................234
21.3.7 Floppy Disk Drive Timing .....................................................................................................235
21.3.8 UART/Parallel Port...............................................................................................................236
21.3.9 Parallel Port Mode Parameters ............................................................................................238
21.3.10 Parallel Port .........................................................................................................................239
21.3.11 KBC Timing Parameters ......................................................................................................248
21.3.12 GPIO Timing Parameters.....................................................................................................251
21.4 LPC Timing.......................................................................................................................... 253
22. TOP MARKING SPECIFICATION ................................................................................................ 254
23. PACKAGE SPECIFICATION ........................................................................................................ 255
Publication Release Date: Aug, 22, 2007
-X-
Version 1.4