MC68HC705JP7 Datasheet, PDF (232/242 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Mechanical Specifications
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest case outline
specifications, contact one of the following:
• Local Motorola Sales Office
• World Wide Web at:
http://www.motorola.com/mcu/
Follow World Wide Web on-line instructions to retrieve the current
mechanical specifications.
16.3 20-Pin Plastic Dual In-Line Package (Case 738)
-A-
20
1
-T-
SEATING
PLANE
E
G
F
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L
FLASH.
M
J 20 PL
0.25 (0.010) ^M T B ^M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
Advance Information
232
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Mechanical Specifications
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