MC68HC705JP7 Datasheet, PDF (231/242 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Freescale Semiconductor, Inc.
Advance Information — MC68HC705JJ7/MC68HC705JP7
Section 16. Mechanical Specifications
16.1 Contents
16.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
16.3 20-Pin Plastic Dual In-Line Package (Case 738) . . . . . . . . . . 232
16.4 20-Pin Small Outline Integrated Circuit (Case 751D) . . . . . . . 233
16.5 28-Pin Plastic Dual In-Line Package (Case 710) . . . . . . . . . . 233
16.6 28-Pin Small Outline Integrated Circuit (Case 751F) . . . . . . . 234
16.7 20-Pin Windowed Ceramic Integrated Circuit
(Case 732) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
16.8 28-Pin Windowed Ceramic Integrated Circuit
(Case 733A). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235
16.2 Introduction
The MC68HC705JJ7 is available in:
• 20-pin plastic dual in-line package (PDIP)
• 20-pin small outline integrated circuit (SOIC) package
• 20-pin windowed ceramic package
The MC68HC705JP7 is available in:
• 28-pin plastic dual in-line package (PDIP)
• 28-pin small outline integrated circuit (SOIC) package
• 28-pin windowed ceramic package
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
Advance Information
231