PIC18CXX2_13 Datasheet, PDF (283/304 Pages) Microchip Technology – High Performance Microcontrollers with 10-bit A/D

PIC18CXX2
40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
W
D
2
n
1
E
A2
c
eB
A
A1
B1
B
p
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Ceramic Package Height
A2
Standoff
A1
Shoulder to Shoulder Width
E
Ceramic Pkg. Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§
eB
Window Diameter
W
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-014
MIN
.185
.155
.030
.595
.514
2.040
.135
.008
.050
.016
.610
.340
INCHES*
NOM
40
.100
.205
.160
.045
.600
.520
2.050
.140
.011
.053
.020
.660
.350
MAX
.225
.165
.060
.625
.526
2.060
.145
.014
.055
.023
.710
.360
MILLIMETERS
MIN
NOM
40
2.54
4.70
5.21
3.94
4.06
0.76
1.14
15.11
15.24
13.06
13.21
51.82
52.07
3.43
3.56
0.20
0.28
1.27
1.33
0.41
0.51
15.49
16.76
8.64
8.89
MAX
5.72
4.19
1.52
15.88
13.36
52.32
3.68
0.36
1.40
0.58
18.03
9.14
 1999-2013 Microchip Technology Inc.
DS39026D-page 283