PIC18CXX2_13 Datasheet, PDF (281/304 Pages) Microchip Technology – High Performance Microcontrollers with 10-bit A/D

PIC18CXX2
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2

n
1
E

eB
A
c
A1
A2
L
B1
B
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
40
40
Pitch
p
.100
2.54
Top to Seating Plane
A
.160
.175
.190
4.06
4.45
Molded Package Thickness
A2
.140
.150
.160
3.56
3.81
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.595
.600
.625
15.11
15.24
Molded Package Width
E1
.530
.545
.560
13.46
13.84
Overall Length
D
2.045
2.058
2.065
51.94
52.26
Tip to Seating Plane
L
.120
.130
.135
3.05
3.30
Lead Thickness
c
.008
.012
.015
0.20
0.29
Upper Lead Width
B1
.030
.050
.070
0.76
1.27
Lower Lead Width
B
.014
.018
.022
0.36
0.46
Overall Row Spacing
§
eB
.620
.650
.680
15.75
16.51
Mold Draft Angle Top

5
10
15
5
10
Mold Draft Angle Bottom

5
10
15
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
MAX
4.83
4.06
15.88
14.22
52.45
3.43
0.38
1.78
0.56
17.27
15
15
 1999-2013 Microchip Technology Inc.
DS39026D-page 281